Effect of Inter-metallic Content on Shear Deformation of Thin Solder Micro-joints Between Copper Substrates — ASN Events

Effect of Inter-metallic Content on Shear Deformation of Thin Solder Micro-joints Between Copper Substrates (114502)

Dr Ajay Kumar 1
  1. Indian Institute of Technology Tirupati India, Tirupati, A.P., India